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Search Results (875 CVEs found)
| CVE | Vendors | Products | Updated | CVSS v3.1 |
|---|---|---|---|---|
| CVE-2017-18322 | 1 Qualcomm | 62 Mdm9206, Mdm9206 Firmware, Mdm9607 and 59 more | 2024-11-21 | N/A |
| Cryptographic key material leaked in WCDMA debug messages in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 835, Snapdragon_High_Med_2016. | ||||
| CVE-2017-18320 | 1 Qualcomm | 64 Msm8996au, Msm8996au Firmware, Sd 410 and 61 more | 2024-11-21 | N/A |
| QSEE unload attempt on a 3rd party TEE without previously loading results in a data abort in snapdragon automobile and snapdragon mobile in versions MSM8996AU, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM439, SDM630, SDM660, SDX24, Snapdragon_High_Med_2016, SXR1130. | ||||
| CVE-2017-18319 | 1 Qualcomm | 60 Mdm9206, Mdm9206 Firmware, Mdm9607 and 57 more | 2024-11-21 | N/A |
| Information leak in UIM API debug messages in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 835, Snapdragon_High_Med_2016. | ||||
| CVE-2017-18279 | 1 Qualcomm | 78 Fsm9055, Fsm9055 Firmware, Fsm9955 and 75 more | 2024-11-21 | 7.8 High |
| Lack of check of buffer length before copying can lead to buffer overflow in camera module in Small Cell SoC, Snapdragon Mobile, Snapdragon Wear in FSM9055, FSM9955, IPQ4019, IPQ8064, MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCA9531, QCA9558, QCA9563, QCA9880, QCA9886, QCA9980, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 835, SDM630, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016. | ||||
| CVE-2017-18173 | 1 Qualcomm | 26 Sd 425, Sd 425 Firmware, Sd 427 and 23 more | 2024-11-21 | N/A |
| In case of using an invalid android verified boot signature with very large length, an integer underflow occurs in Snapdragon Mobile in SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 810, SD 820, SD 835, SDM630, SDM636, SDM660, Snapdragon_High_Med_2016. | ||||
| CVE-2017-18141 | 1 Qualcomm | 68 Ipq8074, Ipq8074 Firmware, Mdm9206 and 65 more | 2024-11-21 | N/A |
| When a 3rd party TEE has been loaded it is possible for the non-secure world to create a secure monitor call which will give it access to privileged functions meant to only be accessible from the TEE in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM439, SDM630, SDM660, SDX24, Snapdragon_High_Med_2016. | ||||
| CVE-2017-18131 | 1 Qualcomm | 56 Mdm9206, Mdm9206 Firmware, Mdm9607 and 53 more | 2024-11-21 | N/A |
| In QTEE, an incorrect fuse value can be blown in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 820, SD 820A, SD 835, SD 845, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016. | ||||
| CVE-2017-15841 | 1 Qualcomm | 32 Sd 410, Sd 410 Firmware, Sd 412 and 29 more | 2024-11-21 | N/A |
| When HOST sends a Special command ID packet, Controller triggers a RAM Dump and FW reset in Snapdragon Mobile in version SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 835, Snapdragon_High_Med_2016. | ||||
| CVE-2017-11004 | 1 Qualcomm | 74 Ipq8074, Ipq8074 Firmware, Mdm9206 and 71 more | 2024-11-21 | N/A |
| A non-secure user may be able to access certain registers in snapdragon automobile, snapdragon mobile and snapdragon wear in versions IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM439, SDM630, SDM660, SDX24, Snapdragon_High_Med_2016. | ||||
| CVE-2024-33014 | 1 Qualcomm | 653 315 5g Iot Modem, 315 5g Iot Modem Firmware, 860 Mobile Platform and 650 more | 2024-11-20 | 7.5 High |
| Transient DOS while parsing ESP IE from beacon/probe response frame. | ||||
| CVE-2024-33015 | 1 Qualcomm | 393 Ar8035, Ar8035 Firmware, Csr8811 and 390 more | 2024-11-20 | 7.5 High |
| Transient DOS while parsing SCAN RNR IE when bytes received from AP is such that the size of the last param of IE is less than neighbor report. | ||||
| CVE-2024-33025 | 1 Qualcomm | 340 Csr8811, Csr8811 Firmware, Fastconnect 6800 and 337 more | 2024-11-20 | 7.5 High |
| Transient DOS while parsing the BSS parameter change count or MLD capabilities fields of the ML IE. | ||||
| CVE-2024-33024 | 1 Qualcomm | 364 Ar8035, Ar8035 Firmware, Csr8811 and 361 more | 2024-11-20 | 7.5 High |
| Transient DOS while parsing the ML IE when a beacon with length field inside the common info of ML IE greater than the ML IE length. | ||||
| CVE-2024-33018 | 1 Qualcomm | 303 Ar8035, Ar8035 Firmware, Csr8811 and 300 more | 2024-11-20 | 7.5 High |
| Transient DOS while parsing the received TID-to-link mapping element of the TID-to-link mapping action frame. | ||||
| CVE-2024-33026 | 1 Qualcomm | 332 Ar8035, Ar8035 Firmware, Csr8811 and 329 more | 2024-11-20 | 7.5 High |
| Transient DOS while parsing probe response and assoc response frame when received frame length is less than max size of timestamp. | ||||
| CVE-2024-33023 | 1 Qualcomm | 317 Ar8035, Ar8035 Firmware, Csra6620 and 314 more | 2024-11-20 | 8.4 High |
| Memory corruption while creating a fence to wait on timeline events, and simultaneously signal timeline events. | ||||
| CVE-2024-33022 | 1 Qualcomm | 251 Ar8035, Ar8035 Firmware, Csra6620 and 248 more | 2024-11-20 | 8.4 High |
| Memory corruption while allocating memory in HGSL driver. | ||||
| CVE-2024-33021 | 1 Qualcomm | 279 Ar8035, Ar8035 Firmware, Csra6620 and 276 more | 2024-11-20 | 8.4 High |
| Memory corruption while processing IOCTL call to set metainfo. | ||||
| CVE-2024-33020 | 1 Qualcomm | 198 Ar8035, Ar8035 Firmware, Fastconnect 6700 and 195 more | 2024-11-20 | 7.5 High |
| Transient DOS while processing TID-to-link mapping IE elements. | ||||
| CVE-2024-33019 | 1 Qualcomm | 299 Ar8035, Ar8035 Firmware, Csr8811 and 296 more | 2024-11-20 | 7.5 High |
| Transient DOS while parsing the received TID-to-link mapping action frame. | ||||