Description
Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface.
Published: 2016-08-07
Score: 7.8 High
EPSS: < 1% Very Low
KEV: No
Impact: n/a
Action: n/a
AI Analysis

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Remediation

No vendor fix or workaround currently provided.

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Tracking

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Advisories
Source ID Title
EUVD EUVD EUVD-2016-3168 Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface.
History

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Subscriptions

Linux Linux Kernel
cve-icon MITRE

Status: PUBLISHED

Assigner: mitre

Published:

Updated: 2024-08-05T23:17:50.340Z

Reserved: 2016-01-25T00:00:00.000Z

Link: CVE-2016-2063

cve-icon Vulnrichment

No data.

cve-icon NVD

Status : Modified

Published: 2016-08-07T21:59:04.987

Modified: 2026-05-06T22:30:45.220

Link: CVE-2016-2063

cve-icon Redhat

Severity : Moderate

Publid Date: 2016-03-30T00:00:00Z

Links: CVE-2016-2063 - Bugzilla

cve-icon OpenCVE Enrichment

No data.

Weaknesses