Description
Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface.
Analysis and contextual insights are available on OpenCVE Cloud.
Remediation
No vendor fix or workaround currently provided.
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Tracking
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Advisories
| Source | ID | Title |
|---|---|---|
EUVD |
EUVD-2016-3168 | Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface. |
References
History
No history.
Status: PUBLISHED
Assigner: mitre
Published:
Updated: 2024-08-05T23:17:50.340Z
Reserved: 2016-01-25T00:00:00.000Z
Link: CVE-2016-2063
No data.
Status : Modified
Published: 2016-08-07T21:59:04.987
Modified: 2026-05-06T22:30:45.220
Link: CVE-2016-2063
OpenCVE Enrichment
No data.
EUVD