CVE-2019-14051 - Vulnerability Details - OpenCVE

Description

Subsequent additions performed during Module loading while allocating the memory would lead to integer overflow and then to buffer overflow in Snapdragon Industrial IOT in MDM9206, MDM9607

Published: 2020-02-07

Score: 7.8 High

EPSS: < 1% Very Low

KEV: No

Impact:

Action:

Analysis

Analysis and contextual insights are available on OpenCVE Cloud.

Default status is the baseline for the product, each version can override it (e.g. patched versions marked unaffected).

Vendor Product Default status Versions

Qualcomm, Inc.

Snapdragon Industrial IOT

affected

Version	Status	Constraints
`MDM9206, MDM9607`	affected	—

Configuration 1 [-]

AND

cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:mdm9206:-:*:*:*:*:*:*:*

Configuration 2 [-]

AND

cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*

cpe:2.3:h:qualcomm:mdm9607:-:*:*:*:*:*:*:*

No data.

No data available yet.

Remediation

No vendor fix or workaround currently provided.

Additional remediation guidance may be available on OpenCVE Cloud.

Tracking

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Advisories

Source	ID	Title
EUVD	EUVD-2019-5308	Subsequent additions performed during Module loading while allocating the memory would lead to integer overflow and then to buffer overflow in Snapdragon Industrial IOT in MDM9206, MDM9607

No CVSS v4.0

Attack Vector Local

Attack Complexity Low

Privileges Required Low

Scope Unchanged

Confidentiality Impact High

Integrity Impact High

Availability Impact High

User Interaction None

No CVSS v3.0

Access Vector Local

Access Complexity Low

Authentication None

Confidentiality Impact Complete

Integrity Impact Complete

Availability Impact Complete

This CVE is not in the KEV list.

The EPSS score is 0.00035.

Key SSVC decision points have not yet been added.

References

Link	Providers
https://www.qualcomm.com/company/product-security/bulletins/february-2020-bulletin

History

No history.

Subscriptions

Qualcomm Mdm9206 Mdm9206 Firmware Mdm9607 Mdm9607 Firmware

MITRE

Status: PUBLISHED

Assigner: qualcomm

Published: 2020-02-07T05:00:39.000Z

Updated: 2024-08-05T00:05:44.159Z

Reserved: 2019-07-19T00:00:00.000Z

Link: CVE-2019-14051

Vulnrichment

No data.

NVD

Status : Modified

Published: 2020-02-07T05:15:11.903

Modified: 2024-11-21T04:25:59.160

Link: CVE-2019-14051

Redhat

No data.

OpenCVE Enrichment

No data.

Weaknesses

CWE-190

{"containers": {"cna": {"affected": [{"product": "Snapdragon Industrial IOT", "vendor": "Qualcomm, Inc.", "versions": [{"status": "affected", "version": "MDM9206, MDM9607"}]}], "descriptions": [{"lang": "en", "value": "Subsequent additions performed during Module loading while allocating the memory would lead to integer overflow and then to buffer overflow in Snapdragon Industrial IOT in MDM9206, MDM9607"}], "problemTypes": [{"descriptions": [{"description": "Integer Overflow to Buffer Overflow Issue in Kernel", "lang": "en", "type": "text"}]}], "providerMetadata": {"dateUpdated": "2020-02-07T05:00:38.000Z", "orgId": "2cfc7d3e-20d3-47ac-8db7-1b7285aff15f", "shortName": "qualcomm"}, "references": [{"tags": ["x_refsource_CONFIRM"], "url": "https://www.qualcomm.com/company/product-security/bulletins/february-2020-bulletin"}], "x_legacyV4Record": {"CVE_data_meta": {"ASSIGNER": "product-security@qualcomm.com", "ID": "CVE-2019-14051", "STATE": "PUBLIC"}, "affects": {"vendor": {"vendor_data": [{"product": {"product_data": [{"product_name": "Snapdragon Industrial IOT", "version": {"version_data": [{"version_value": "MDM9206, MDM9607"}]}}]}, "vendor_name": "Qualcomm, Inc."}]}}, "data_format": "MITRE", "data_type": "CVE", "data_version": "4.0", "description": {"description_data": [{"lang": "eng", "value": "Subsequent additions performed during Module loading while allocating the memory would lead to integer overflow and then to buffer overflow in Snapdragon Industrial IOT in MDM9206, MDM9607"}]}, "problemtype": {"problemtype_data": [{"description": [{"lang": "eng", "value": "Integer Overflow to Buffer Overflow Issue in Kernel"}]}]}, "references": {"reference_data": [{"name": "https://www.qualcomm.com/company/product-security/bulletins/february-2020-bulletin", "refsource": "CONFIRM", "url": "https://www.qualcomm.com/company/product-security/bulletins/february-2020-bulletin"}]}}}, "adp": [{"providerMetadata": {"orgId": "af854a3a-2127-422b-91ae-364da2661108", "shortName": "CVE", "dateUpdated": "2024-08-05T00:05:44.159Z"}, "title": "CVE Program Container", "references": [{"tags": ["x_refsource_CONFIRM", "x_transferred"], "url": "https://www.qualcomm.com/company/product-security/bulletins/february-2020-bulletin"}]}]}, "cveMetadata": {"assignerOrgId": "2cfc7d3e-20d3-47ac-8db7-1b7285aff15f", "assignerShortName": "qualcomm", "cveId": "CVE-2019-14051", "datePublished": "2020-02-07T05:00:39.000Z", "dateReserved": "2019-07-19T00:00:00.000Z", "dateUpdated": "2024-08-05T00:05:44.159Z", "state": "PUBLISHED"}, "dataType": "CVE_RECORD", "dataVersion": "5.1"}

{"configurations": [{"nodes": [{"cpeMatch": [{"criteria": "cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*", "matchCriteriaId": "A960B86A-C397-4ACB-AEE6-55F316D32949", "vulnerable": true}], "negate": false, "operator": "OR"}, {"cpeMatch": [{"criteria": "cpe:2.3:h:qualcomm:mdm9206:-:*:*:*:*:*:*:*", "matchCriteriaId": "D79B8959-3D1E-4B48-9181-D75FE90AAF98", "vulnerable": false}], "negate": false, "operator": "OR"}], "operator": "AND"}, {"nodes": [{"cpeMatch": [{"criteria": "cpe:2.3:o:qualcomm:mdm9607_firmware:-:*:*:*:*:*:*:*", "matchCriteriaId": "A35FECFB-60AE-42A8-BCBB-FEA7D5826D49", "vulnerable": true}], "negate": false, "operator": "OR"}, {"cpeMatch": [{"criteria": "cpe:2.3:h:qualcomm:mdm9607:-:*:*:*:*:*:*:*", "matchCriteriaId": "E9765187-8653-4D66-B230-B2CE862AC5C0", "vulnerable": false}], "negate": false, "operator": "OR"}], "operator": "AND"}], "descriptions": [{"lang": "en", "value": "Subsequent additions performed during Module loading while allocating the memory would lead to integer overflow and then to buffer overflow in Snapdragon Industrial IOT in MDM9206, MDM9607"}, {"lang": "es", "value": "Las adiciones posteriores llevadas a cabo durante la carga del M\u00f3dulo mientras se asigna la memoria conllevar\u00eda a un desbordamiento de enteros y luego al desbordamiento del b\u00fafer en los productos Snapdragon Industrial IOT en las versiones MDM9206, MDM9607."}], "id": "CVE-2019-14051", "lastModified": "2024-11-21T04:25:59.160", "metrics": {"cvssMetricV2": [{"acInsufInfo": false, "baseSeverity": "HIGH", "cvssData": {"accessComplexity": "LOW", "accessVector": "LOCAL", "authentication": "NONE", "availabilityImpact": "COMPLETE", "baseScore": 7.2, "confidentialityImpact": "COMPLETE", "integrityImpact": "COMPLETE", "vectorString": "AV:L/AC:L/Au:N/C:C/I:C/A:C", "version": "2.0"}, "exploitabilityScore": 3.9, "impactScore": 10.0, "obtainAllPrivilege": false, "obtainOtherPrivilege": false, "obtainUserPrivilege": false, "source": "nvd@nist.gov", "type": "Primary", "userInteractionRequired": false}], "cvssMetricV31": [{"cvssData": {"attackComplexity": "LOW", "attackVector": "LOCAL", "availabilityImpact": "HIGH", "baseScore": 7.8, "baseSeverity": "HIGH", "confidentialityImpact": "HIGH", "integrityImpact": "HIGH", "privilegesRequired": "LOW", "scope": "UNCHANGED", "userInteraction": "NONE", "vectorString": "CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H", "version": "3.1"}, "exploitabilityScore": 1.8, "impactScore": 5.9, "source": "nvd@nist.gov", "type": "Primary"}]}, "published": "2020-02-07T05:15:11.903", "references": [{"source": "product-security@qualcomm.com", "tags": ["Vendor Advisory"], "url": "https://www.qualcomm.com/company/product-security/bulletins/february-2020-bulletin"}, {"source": "af854a3a-2127-422b-91ae-364da2661108", "tags": ["Vendor Advisory"], "url": "https://www.qualcomm.com/company/product-security/bulletins/february-2020-bulletin"}], "sourceIdentifier": "product-security@qualcomm.com", "vulnStatus": "Modified", "weaknesses": [{"description": [{"lang": "en", "value": "CWE-190"}], "source": "nvd@nist.gov", "type": "Primary"}]}